Product Description
This high precision UV picosecond laser cutting machine is designed for nonmetal composite materials such as PI film, cover film, FPC, and PCB. It features water cooling, a gantry structure, and ultrafast laser technology with positioning accuracy of ±1um and processing speed up to 3000mm/s. Ideal for aerospace, automotive, and semiconductor industries.
Technical Specifications
| Model NO. | CS-0605-V-A |
| After-sales Service | Remote Technical Support |
| Warranty | 12 Months |
| Application | Aerospace Industry, Automotive Industry, Semiconductors/3c/Semiconductor |
| Cooling System | Water Cooling |
| Technical Class | Pulse Laser |
| Applicable Material | Nonmetal |
| Structure Type | Gantry Type |
| Laser Classification | Solid Laser |
| Laser Technology | Laser Flame Cutting |
| Laser Type | Ultrafast Laser |
| Laser Power | 10W/30W/35W |
| Working Area | 500*610mm |
| Positioning Accuracy | ±1um |
| Processing Speed | ≤3000mm/S |
| Processing Accuracy | ≤30um |
| Focus Spot | ≤20um |
| Scan Range of Galavanometer | 50*50um |
| Machinery Test Report | Provided |
| Video Outgoing-Inspection | Provided |
| Certification | CE |
| Processing Thickness | 3mm |
| Processing Material | Pi Film, Cover Film, FPC, PCB, etc. |
| Power Supply | AC 380V±10%, 50~60Hz |
| Transport Package | Wooden Case |
| Specification | 2200*1500*1750mm |
| Trademark | CHANXAN |
| Origin | Suzhou |